SM662PAC BFST
IC FLASH 512GBIT EMMC 153BGAManufacturer: Silicon Motion, Inc.
Categories: Memory
Quality Control: Learn More
Silicon Motion, Inc. Ferri-eMMC® SM662PAC-BFST is a 512Gbit NAND Flash memory component utilizing Triple-Level Cell (TLC) technology. This non-volatile memory is organized as 64G x 8 and adheres to the eMMC interface standard. Packaged in a 153-BGA (11.5x13) footprint, it is designed for surface mount applications and operates within a temperature range of -40°C to 85°C. The SM662PAC-BFST is suitable for embedded storage solutions in consumer electronics, automotive systems, and industrial applications requiring reliable data retention and high-density flash storage.
Additional Information
Series: Ferri-eMMC®RoHS Status: ROHS3 CompliantManufacturer Lead Time: 14 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 153-TFBGA |
| Mounting Type | Surface Mount |
| Memory Size | 512Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | - |
| Technology | FLASH - NAND (TLC) |
| Memory Format | FLASH |
| Supplier Device Package | 153-BGA (11.5x13) |
| Write Cycle Time - Word, Page | - |
| Memory Interface | eMMC |
| Memory Organization | 64G x 8 |
| Programmable | Not Verified |
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