SM662PAC-BDSS
IC FLASH 160GBIT EMMC 153BGAManufacturer: Silicon Motion, Inc.
Categories: Memory
Quality Control: Learn More
Silicon Motion, Inc. Ferri-eMMC® SM662PAC-BDSS is a 160 Gigabit NAND Flash memory component utilizing SLC technology. This high-density eMMC device is designed for demanding applications requiring robust data storage. The SM662PAC-BDSS features a 153-BGA (11.5x13) surface mount package, conforming to the 153-TFBGA standard. Its memory organization is 20G x 8, providing efficient data access. This component is suitable for various industrial sectors, including automotive, industrial automation, and consumer electronics, where reliable non-volatile storage is critical. The operating temperature range is -40°C to 85°C, ensuring performance in diverse environmental conditions.
Additional Information
Series: Ferri-eMMC®RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 153-TFBGA |
| Mounting Type | Surface Mount |
| Memory Size | 160Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | - |
| Technology | FLASH - NAND (SLC) |
| Memory Format | FLASH |
| Supplier Device Package | 153-BGA (11.5x13) |
| Write Cycle Time - Word, Page | - |
| Memory Interface | eMMC |
| Memory Organization | 20G x 8 |
| Programmable | Not Verified |
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