SM662GXD-BD
FERRI-EMMC BGA 100-B EMMC 3D TLCManufacturer: Silicon Motion, Inc.
Categories: Memory
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Silicon Motion, Inc. FERRI-EMMC BGA 100-B eMMC device. This component utilizes 3D TLC NAND technology for high-density storage solutions. Designed for embedded applications, its BGA package facilitates compact board layouts. The SM662GXD-BD is suitable for industries requiring robust and efficient data storage, including consumer electronics, industrial automation, and automotive systems. This eMMC solution provides a reliable interface for data storage and retrieval in a wide range of demanding environments.
Additional Information
Series: RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: TrayDownload Free CAD Model:
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