SM662GXC-BD
FERRI-EMMC BGA 100-B EMMC 3D TLCManufacturer: Silicon Motion, Inc.
Categories: Memory
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Silicon Motion, Inc. FERRI-EMMC BGA 100-B eMMC device, part number SM662GXC-BD, offers a 3D TLC NAND flash memory solution. This embedded MultiMediaCard (eMMC) component is designed for high-density storage applications, featuring a Ball Grid Array (BGA) 100-ball package for efficient board integration. The SM662GXC-BD is suitable for demanding environments requiring reliable and high-performance data storage. Its architecture is optimized for applications in consumer electronics, industrial automation, and automotive systems where robust memory is critical. This component is supplied in tray packaging.
Additional Information
Series: RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: TrayDownload Free CAD Model:
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