SM662GXB-BDST
IC FLASH 256GBIT EMMC 100BGAManufacturer: Silicon Motion, Inc.
Categories: Memory
Quality Control: Learn More
Silicon Motion, Inc. Ferri-eMMC® SM662GXB-BDST is a 256Gbit NAND Flash memory device utilizing Triple-Level Cell (TLC) technology. This non-volatile memory component is presented in a 100-LBGA package with a 14x18mm footprint, designed for surface mount applications. The device adheres to the eMMC interface standard, with a memory organization of 32 Gigabits x 8. Operating within a temperature range of -25°C to 85°C, the SM662GXB-BDST is suitable for applications requiring high-density storage, including automotive systems and industrial control.
Additional Information
Series: Ferri-eMMC®RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 100-LBGA |
| Mounting Type | Surface Mount |
| Memory Size | 256Gbit |
| Memory Type | Non-Volatile |
| Operating Temperature | -25°C ~ 85°C |
| Voltage - Supply | - |
| Technology | FLASH - NAND (TLC) |
| Memory Format | FLASH |
| Supplier Device Package | 100-BGA (14x18) |
| Write Cycle Time - Word, Page | - |
| Memory Interface | eMMC |
| Memory Organization | 32G x 8 |
| Programmable | Not Verified |
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