Silicon Motion, Inc. FERRI-EMMC BGA 100-B eMMC, 3D TLC. This embedded MultiMediaCard (eMMC) storage solution offers robust performance and reliability for demanding applications. Featuring 3D TLC NAND technology, it provides optimized read/write speeds and endurance suitable for industrial, automotive, and consumer electronics sectors. The BGA 100-ball package ensures compact integration into printed circuit board designs. This component is engineered for high-density data storage and efficient data management within embedded systems.
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Series:RoHS Status:Manufacturer Lead Time:Product Status: ActivePackaging: Tray