SM662GEE-BD
FERRI-EMMC BGA 100-B EMMC 3D TLCManufacturer: Silicon Motion, Inc.
Categories: Memory
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Silicon Motion, Inc. FERRI-EMMC BGA 100-B, part number SM662GEE-BD, is a 3D TLC eMMC storage solution. This component is designed for high-density data storage applications, offering robust performance and reliability. Its BGA 100-ball package facilitates efficient board integration and signal integrity. The SM662GEE-BD is suitable for use in a variety of demanding applications, including industrial automation, automotive systems, and consumer electronics where embedded storage is critical. Its architecture supports advanced error correction and wear-leveling mechanisms inherent to 3D NAND technology, ensuring data integrity and extended operational life. This component is supplied in tray packaging, suitable for high-volume manufacturing environments.
Additional Information
Series: RoHS Status: Manufacturer Lead Time: Product Status: ActivePackaging: TrayDownload Free CAD Model:
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