ZSSC3154BA1C
DICE (WAFER SAWN) - FRAMEManufacturer: Renesas Electronics Corporation
Categories: Sensor and Detector Interfaces
Quality Control: Learn More
Renesas Electronics Corporation ZSSC3154BA1C is a bare die (wafer sawn) electronic component supplied in tray packaging. This device is a key enabling technology within the sensor and detector interfaces category, offering advanced signal conditioning and processing capabilities. Its unpackaged form factor is optimized for high-volume manufacturing and custom integration into advanced system-on-chip (SoC) designs. The ZSSC3154BA1C is utilized in applications requiring precise measurement and data acquisition where board space and thermal management are critical design considerations. This component is frequently found in automotive, industrial automation, and medical device sectors, where reliability and performance are paramount.
Additional Information
Series: -RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Programmable | Not Verified |
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