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UPD70F3422GJ(A)-GAE-AX

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UPD70F3422GJ(A)-GAE-AX

IC MCU 32BIT 384KB FLASH 144LQFP

Manufacturer: Renesas Electronics Corporation

Categories: Microcontrollers

Quality Control: Learn More

Renesas Electronics Corporation V850 microcontroller, part number UPD70F3422GJ-A-GAE-AX, features a 32-bit V850E1 core operating at 32MHz. This device offers 384KB of FLASH program memory and 16KB of RAM. Connectivity options include CANbus, CSI, I2C, and UART/USART. Peripherals include DMA, I2S, POR, PWM, and WDT. The component is equipped with 12x10-bit SAR Analog-to-Digital converters. It is supplied in a 144-LQFP (20x20) surface mount package and operates within a temperature range of -40°C to 85°C. This microcontroller is suitable for applications in automotive, industrial automation, and consumer electronics.

Additional Information

Series: V850RoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Bulk
Technical Details:
PackagingBulk
Package / Case144-LQFP
Mounting TypeSurface Mount
Speed32MHz
Program Memory Size384KB (384K x 8)
RAM Size16K x 8
Operating Temperature-40°C ~ 85°C (TA)
Oscillator TypeInternal
Program Memory TypeFLASH
EEPROM Size-
Core ProcessorV850E1
Data ConvertersA/D 12x10b SAR
Core Size32-Bit
Voltage - Supply (Vcc/Vdd)3.5V ~ 5.5V
ConnectivityCANbus, CSI, I2C, UART/USART
PeripheralsDMA, I2S, POR, PWM, WDT
Supplier Device Package144-LQFP (20x20)
Number of I/O98

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Microcontroller FAQs

A microcontroller is a compact integrated circuit that combines a processor, memory, and input/output peripherals for embedded control applications.

Microcontrollers execute programmed instructions to process sensor inputs and control outputs such as motors, displays, and communication interfaces.

Microcontrollers are commonly used in:

  • Automotive systems
  • Robotics
  • IoT devices
  • Industrial automation
  • Household appliances
  • Smart electronics

Microcontrollers integrate memory and peripherals on-chip for dedicated tasks, while microprocessors are designed for higher-performance computing systems requiring external components.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.