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HD64F3687GFPV

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HD64F3687GFPV

IC MCU 16BIT 56KB FLASH 64LQFP

Manufacturer: Renesas Electronics Corporation

Categories: Microcontrollers

Quality Control: Learn More

Renesas Electronics Corporation H8® H8/300H Tiny series microcontroller, part number HD64F3687GFPV. This 16-bit MCU features an H8/300H core operating at 20MHz. It offers 56KB of FLASH program memory and 4KB of RAM. Connectivity options include I2C and SCI interfaces. Integrated peripherals include LVD, POR, PWM, and WDT. It also incorporates 8x10-bit A/D converters. The device is packaged in a 64-LFQFP (10x10) for surface mounting and operates within a temperature range of -20°C to 75°C. This component is suitable for applications in industrial automation and consumer electronics.

Additional Information

Series: H8® H8/300H TinyRoHS Status: ROHS3 CompliantManufacturer Lead Time: 12 week(s)Product Status: Last Time BuyPackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case64-LQFP
Mounting TypeSurface Mount
Speed20MHz
Program Memory Size56KB (56K x 8)
RAM Size4K x 8
Operating Temperature-20°C ~ 75°C (TA)
Oscillator TypeInternal
Program Memory TypeFLASH
EEPROM Size-
Core ProcessorH8/300H
Data ConvertersA/D 8x10b
Core Size16-Bit
Voltage - Supply (Vcc/Vdd)3V ~ 5.5V
ConnectivityI2C, SCI
PeripheralsLVD, POR, PWM, WDT
Supplier Device Package64-LFQFP (10x10)
Number of I/O45
ProgrammableNot Verified

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Microcontroller FAQs

A microcontroller is a compact integrated circuit that combines a processor, memory, and input/output peripherals for embedded control applications.

Microcontrollers execute programmed instructions to process sensor inputs and control outputs such as motors, displays, and communication interfaces.

Microcontrollers are commonly used in:

  • Automotive systems
  • Robotics
  • IoT devices
  • Industrial automation
  • Household appliances
  • Smart electronics

Microcontrollers integrate memory and peripherals on-chip for dedicated tasks, while microprocessors are designed for higher-performance computing systems requiring external components.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.