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ISL83220ECVZ-T

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ISL83220ECVZ-T

IC TRANSCEIVER FULL 1/1 16TSSOP

Manufacturer: Renesas Electronics Corporation

Categories: Drivers, Receivers, Transceivers

Quality Control: Learn More

The Renesas Electronics Corporation ISL83220ECVZ-T is a single-chip, full-duplex RS-232 transceiver. This component features one driver and one receiver, operating at data rates up to 250kbps. It is supplied in a 16-TSSOP package with a surface mount configuration, suitable for applications requiring compact board layouts. The device operates across a voltage supply range of 3V to 5.5V and includes 300mV of receiver hysteresis for improved noise immunity. This transceiver finds application in industrial automation, medical equipment, and consumer electronics. The ISL83220ECVZ-T is delivered on tape and reel for automated assembly processes.

Additional Information

Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)Datasheet:
Technical Details:
PackagingTape & Reel (TR)
Package / Case16-TSSOP (0.173"", 4.40mm Width)
Mounting TypeSurface Mount
TypeTransceiver
Operating Temperature0°C ~ 70°C
Voltage - Supply3V ~ 5.5V
Number of Drivers/Receivers1/1
Data Rate250kbps
ProtocolRS232
Supplier Device Package16-TSSOP
Receiver Hysteresis300 mV
DuplexFull

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An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.