Home

Products

Integrated Circuits (ICs)

Clock/Timing

Application Specific Clock/Timing

9DB401BGLF

Banner
productimage

9DB401BGLF

IC BUFFER 4OUTPUT DIFF 28-TSSOP

Manufacturer: Renesas Electronics Corporation

Categories: Application Specific Clock/Timing

Quality Control: Learn More

Renesas Electronics Corporation 9DB401BGLF is a PCI Express (PCIe) Fanout Buffer featuring zero-delay distribution. This electronic component operates at a maximum frequency of 333.33MHz with HCSL input and HCSL/LVDS outputs. It is designed with a 1:4 input to output ratio, providing four differential outputs from a single input. The device utilizes a PLL for precise clock generation and synchronization. The 9DB401BGLF is housed in a 28-TSSOP package, suitable for surface mounting. Its operating temperature range is 0°C to 70°C, and it requires a supply voltage between 3.135V and 3.465V. This buffer is commonly employed in applications requiring high-speed clock distribution for PCIe interfaces, including computing, networking, and data center infrastructure.

Additional Information

Series: -RoHS Status: unknownManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tube
Technical Details:
PackagingTube
Package / Case28-TSSOP (0.173"", 4.40mm Width)
Mounting TypeSurface Mount
OutputHCSL, LVDS
Frequency - Max333.33MHz
InputHCSL
Operating Temperature0°C ~ 70°C
Voltage - Supply3.135V ~ 3.465V
Main PurposePCI Express (PCIe)
Ratio - Input:Output1:4
Differential - Input:OutputYes/Yes
Supplier Device Package28-TSSOP
PLLYes
Number of Circuits1
ProgrammableNot Verified

Request a Quote

Name (required)

Phone (required)

Work Email (required)

Country (required)

Company Name (required)

CAPTCHA

By providing a telephone number and submitting the form, you are consenting to be contacted by SMS text message and agreeing to our Privacy Policy. Message frequency may vary. Message and data rates may apply. Reply STOP to opt out of further messaging. Reply HELP for more information.
Clients Also Buy
Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

The different types of integrated circuits include:

Frequently Asked Questions

As a full line supplier, we specialize in sourcing obsolete and hard to find electronic components for your projects.

After we receive your request submission, one of our account executives will reach out to your team to gather more information about your project requirements and ensure we tailor the order to your needs.

Once requirements such as date codes, quantities, target prices, testing requirements, and more are discussed, our purchasing team will secure stock through Microchip USA’s direct access to manufacturing partners’ excess inventory lists.

Our operations teams will handle logistics and fulfillment to ensure supply chain continuity, and our support team will provide clear communication throughout the process.

Our net terms for electronic component sourcing are flexible and vary by order. Our account executives will work with you to ensure our terms meet your company’s needs. We also offer scheduled shipments and inventory management solutions to ensure a steady supply of electronic components, maintain cash flow, and maximize warranty periods. We always offer a warranty on all tested parts. See our sales terms and conditions for more information.

We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.