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TOP242FN

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TOP242FN

IC OFFLINE SW FLYBACK TO262-7C

Manufacturer: Power Integrations

Categories: AC DC Converters, Offline Switches

Quality Control: Learn More

Power Integrations TOPSwitch®-GX series TOP242FN is an offline switcher IC designed for flyback topologies. This device integrates a high voltage MOSFET and a PWM controller within a TO-262-7C package, offering a robust solution for AC-DC power conversion. Featuring a switching frequency range of 66kHz to 132kHz and a maximum duty cycle of 66.5%, the TOP242FN provides efficient operation for up to 22W output power. Integrated fault protection mechanisms include current limiting, over-temperature, and over-voltage protection, ensuring system reliability. Its through-hole mounting and isolated output make it suitable for applications in consumer electronics, industrial control, and power supplies. The 700V breakdown voltage rating allows for direct connection to rectified AC line inputs.

Additional Information

Series: TOPSwitch®-GXRoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tube
Technical Details:
PackagingTube
Package / CaseTO-262-7 (6 Leads) Formed Leads
Mounting TypeThrough Hole
Operating Temperature-40°C ~ 150°C (TJ)
Duty Cycle66.5%
Frequency - Switching66kHz ~ 132kHz
Internal Switch(s)Yes
Voltage - Breakdown700V
Output IsolationIsolated
TopologyFlyback
Voltage - Supply (Vcc/Vdd)-
Supplier Device PackageTO-262-7C
Fault ProtectionCurrent Limiting, Over Temperature, Over Voltage
Control FeaturesFrequency Control
Power (Watts)22 W

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Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.