CMDBIG-X
MOD BASE 2POS DSUB GRAYManufacturer: Panduit Corp
Categories: Keystone Connector Accessories
Quality Control: Learn More
Panduit Corp Mini-Com® CMDBIG-X is a two-position D-sub connector blank insert module designed for robust connectivity solutions. Constructed from durable Acrylonitrile Butadiene Styrene (ABS) in a neutral gray color, this blank insert provides a clean termination point within the Mini-Com® series of modular connectivity components. Its dimensions are 18.30mm in height and 31.50mm in width, making it suitable for various network infrastructure and telecommunications applications. The CMDBIG-X is compatible with Panduit's Mini-Com® series, including flat, sloped, sloped recessed, and blank modules, offering flexibility in system design. This component is commonly utilized in data centers, enterprise networking, and industrial automation environments where reliable signal integrity and organized cabling are paramount. The product is supplied in bulk packaging.
Additional Information
Series: Mini-Com®RoHS Status: RoHS CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Color | Gray |
| Size / Dimension | 18.30mm H x 31.50mm W |
| For Use With/Related Products | Mini-Com® Series (Flat, Sloped, Sloped Recessed or Blank) |
| Material | Acrylonitrile Butadiene Styrene (ABS) |
| Type | Blank Insert, Module |
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