21277-003-XTP
IC INTERFACE BGAManufacturer: onsemi
Categories: Unclassified
Quality Control: Learn More
This onsemi electronic component, part number 21277-003-XTP, is an interface IC supplied in Tape & Reel packaging. Its BGA (Ball Grid Array) package signifies a high-density, surface-mount solution suitable for complex board layouts. As a critical interface component, it facilitates communication and signal integrity between various functional blocks within an electronic system. This type of component is commonly deployed in demanding applications across the automotive, industrial automation, and advanced consumer electronics sectors where reliable data transfer and signal conditioning are paramount. The BGA package offers excellent thermal performance and electrical connectivity, making it a strong choice for high-performance designs.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
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