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FDMF6823B

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FDMF6823B

IC HALF BRIDGE DRIVER 55A 40PQFN

Manufacturer: onsemi

Categories: Full Half-Bridge (H Bridge) Drivers

Quality Control: Learn More

The onsemi XS™ DrMOS FDMF6823B is a high-performance half-bridge driver designed for synchronous buck converters. This DrMOS component integrates power MOSFETs and a driver IC within a compact 40-PQFN (6x6) package, facilitating efficient power delivery. It offers a continuous output current of 55A per channel with a peak output capability also at 55A. Key features include a bootstrap circuit for high-side driver operation and diode emulation for enhanced efficiency. Fault protection mechanisms such as over-temperature, shoot-through, and undervoltage lockout (UVLO) are integrated for robust operation. The FDMF6823B supports PWM and logic interfaces and is suitable for inductive, capacitive, and resistive loads. Operating across a load voltage range of 3V to 16V and a supply voltage of 4.5V to 5.5V, it functions reliably within an ambient temperature range of -40°C to 125°C. This component finds application in demanding power supply designs across various industries requiring efficient voltage regulation.

Additional Information

Series: XS™ DrMOSRoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)
Technical Details:
FeaturesBootstrap Circuit, Diode Emulation
PackagingTape & Reel (TR)
Package / Case40-PowerTFQFN
Mounting TypeSurface Mount
InterfaceLogic, PWM
Operating Temperature-40°C ~ 125°C (TA)
Output ConfigurationHalf Bridge
Voltage - Supply4.5V ~ 5.5V
Rds On (Typ)1Ohm LS, 1Ohm HS
ApplicationsSynchronous Buck Converters
Current - Output / Channel55A
Current - Peak Output55A
TechnologyDrMOS, Power MOSFET
Voltage - Load3V ~ 16V
Supplier Device Package40-PQFN (6x6)
Fault ProtectionOver Temperature, Shoot-Through, UVLO
Load TypeInductive, Capacitive, Resistive

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onsemi FAQs

onsemi manufactures power and analog semiconductor components focused on energy efficiency, sensing, and intelligent power management.

onsemi’s core components include:

  • Power semiconductors (MOSFETs, IGBTs, and SiC devices)
  • Power management ICs (PMICs)
  • Analog and mixed-signal ICs
  • Image sensors and sensing technologies
  • Signal conditioning and interface components
  • Discrete and module-based power solutions

onsemi specializes in energy-efficient and high-reliability semiconductor solutions for electrification and automation.

onsemi serves industries that require efficient power conversion, sensing, and high-performance electronics.

onsemi’s key industries include:

These industries rely on onsemi for power efficiency, system reliability, and advanced sensing capabilities.

onsemi is known for power, sensing, and energy-efficient semiconductor product lines used in automotive, industrial, and energy applications.

Key onsemi product lines include:

  • EliteSiC - silicon carbide (SiC) power devices for high-efficiency power conversion
  • EcoSpin - integrated motor driver solutions for industrial and automotive systems
  • Treo platform - intelligent power modules for automotive applications
  • Hyperlux image sensors - high-performance imaging solutions
  • AR series image sensors - CMOS sensors for automotive and industrial vision
  • NCP / NCV series - power management ICs and automotive-grade solutions
  • FD / FDM series MOSFETs - discrete power transistors
  • NB / NC series - signal conditioning and interface ICs
Integrated Circuit FAQs

An integrated circuit (IC) is a semiconductor chip that contains transistors, resistors, capacitors, and other electronic components on a single silicon substrate. ICs are the foundation of modern electronics and power devices such as smartphones, computers, automotive systems, and industrial equipment.

Integrated circuits work by routing electrical signals through microscopic semiconductor components fabricated onto a silicon chip. Depending on the design, ICs can process, amplify, store, or control electronic data.

Integrated circuits are used in:

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Frequently Asked Questions

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We partner with industry-leading AS6171 & AS6081-certified third party testing labs to mitigate risk and support a wide array of end uses for your company’s requirements. Testing includes but isn’t limited to: Decapsulation & Internal Dye Verification. X-Ray Inspection & Analysis, External Visual Inspection, Surface Texture Analysis (SEM), and Electrical Pin Correlation.