OSD32MP157F-512M-EAA
SYSTEM IN A PACKAGE ( SIP)Manufacturer: Octavo Systems LLC
Categories: Microcontrollers, Microprocessor, FPGA Modules
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The Octavo Systems LLC OSD32MP157F-512M-EAA is a System in Package (SiP) module integrating the STM32MP157F microprocessor core. This high-performance component operates at 800MHz and includes 512MB of RAM, providing a robust solution for complex embedded applications. Its compact 18.00mm x 18.00mm footprint, delivered in tray packaging, facilitates dense board designs. The OSD32MP157F-512M-EAA supports DSI connectivity and is designed for operation within an industrial temperature range of -20°C to 85°C. This MPU core module is well-suited for industries such as industrial automation, IoT gateways, and advanced human-machine interfaces where significant processing power and integrated memory are critical.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Connector Type | DSI |
| Size / Dimension | 0.710"" L x 0.710"" W (18.00mm x 18.00mm) |
| Speed | 800MHz |
| RAM Size | 512MB |
| Operating Temperature | -20°C ~ 85°C |
| Module/Board Type | MPU Core |
| Core Processor | STM32MP157F |
| Co-Processor | - |
| Flash Size | - |
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