TDA18264HB/C1
INTEGRATED CIRCUITManufacturer: NXP USA Inc.
Categories: Telecom
Quality Control: Learn More
NXP USA Inc. TDA18264HB-C1 is a highly integrated transceiver component, essential for advanced telecommunications applications. This device is engineered for robust performance in demanding environments, featuring an 80-HTQFNR-EP (12x12) package for efficient thermal management and compact board layouts. The TDA18264HB-C1 is designed for surface mount assembly, facilitating scalable manufacturing processes. Its architecture supports critical functions within telecommunication systems, contributing to reliable signal processing and network connectivity. The component's power dissipation is rated at 2.55 W, indicating its suitability for high-performance networking and data infrastructure. This part is frequently utilized in the development of base stations, network interface devices, and other critical telecommunications equipment.
Additional Information
Series: -RoHS Status: RoHS non-compliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 80-TFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Function | Transceiver |
| Interface | - |
| Operating Temperature | - |
| Voltage - Supply | - |
| Current - Supply | - |
| Supplier Device Package | 80-HTQFNR-EP (12x12) |
| Number of Circuits | 16 |
| Power (Watts) | 2.55 W |
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