M82108G13
IC TELECOM INTERFACE 672TEPBGAManufacturer: NXP USA Inc.
Categories: Telecom
Quality Control: Learn More
NXP USA Inc.'s M82108G13 is a high-performance telecommunications interface component. This electronic component is housed in a 672-TEPBGA (27x27) surface-mount package, ensuring robust integration into complex circuit designs. Optimized for demanding telecom applications, the M82108G13 facilitates efficient data handling and signal processing within networking infrastructure. Its advanced architecture and precise manufacturing by NXP USA Inc. make it suitable for use in carrier-grade equipment, data centers, and high-speed communication systems. The 672-TEPBGA package provides a compact footprint and excellent thermal performance, crucial for dense board layouts and extended operational reliability.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: BulkDownload Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 672-BGA |
| Mounting Type | Surface Mount |
| Supplier Device Package | 672-TEPBGA (27x27) |
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