

Manufacturer: NXP USA Inc.
Categories: System On Chip (SoC)
Quality Control: Learn More
| Packaging | Tray |
| Package / Case | 548-LFBGA |
| Speed | 1.8GHz, 800MHz |
| RAM Size | 868KB |
| Operating Temperature | 0°C ~ 95°C (TJ) |
| Core Processor | ARM® Cortex®-A53, ARM® Cortex®-M7, Hi-Fi4 DSP |
| Primary Attributes | - |
| Connectivity | CANbus, Ethernet, I2C, I2S, PCIe, SD/SDIO, SPI, UART |
| Peripherals | DMA, PWM, WDT |
| Supplier Device Package | 548-LFBGA (15x15) |
| Architecture | DSP, MCU, MPU |
| Flash Size | - |