SC900841JVKR2
IC POWER MGT 338-MAPBGAManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. SC900841JVKR2, a power management integrated circuit, is packaged in a 338-TFBGA (11x11) footprint, supplied on tape and reel. This component is engineered for demanding applications within the Personal Computer and Personal Digital Assistant sectors. Its surface mount design facilitates efficient board assembly. Operating within a temperature range of -40°C to 85°C, the SC900841JVKR2 offers robust performance for power regulation and management tasks.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: No lead time information availableProduct Status: ObsoletePackaging: Tape & Reel (TR)Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 338-TFBGA |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 85°C |
| Voltage - Supply | - |
| Applications | PC's, PDA's |
| Current - Supply | - |
| Supplier Device Package | 338-TFBGA (11x11) |
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