NXP USA Inc. presents the PF5024, a high-performance power management integrated circuit designed to support i.MX 8 processor-based applications. This component, identified by part number MPF5024AVNA0ES, is housed in a 40-HVQFN (6x6) package with an exposed pad, ensuring efficient thermal management. The PF5024 features a surface mount, wettable flank mounting type, facilitating robust soldering processes. Operating across a temperature range of -40°C to 125°C (TA), it is suitable for demanding environments. Its robust construction and advanced power management capabilities make it ideal for use in automotive, industrial automation, and high-end consumer electronics sectors where reliable and efficient power delivery is critical for complex processing systems.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 16 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 40-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Applications | High Performance i.MX 8 Processor Based |
| Current - Supply | - |
| Supplier Device Package | 40-HVQFN (6x6) |
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