MFS8633BMBA0ESR2
SAFETY SYSTEM BASIS CHIP FOR DOMManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. offers the MFS8633BMBA0ESR2, an advanced safety system basis chip designed for automotive camera applications. This electronic component, housed in a 48-HVQFN (7x7) package with wettable flank surface mount technology, operates within a wide temperature range of -40°C to 125°C. Featuring a robust 36V supply voltage capability, it is AEC-Q100 qualified, ensuring reliability for demanding automotive environments. The MFS8633BMBA0ESR2 is supplied on tape and reel, suitable for high-volume manufacturing processes. Its specialized design caters to critical automotive safety functions within camera systems.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 36V |
| Applications | Camera |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
Request a Quote
Clients Also Buy
MC34PF1510A7EPR2
PF1510
MFS2601AMBA0ADR2
AUTO SBC
MC33PF8200DNES
POWER MANAGEMENT IC I.MX8 PRE-PR
