MFS8632BMDA0ES
IC FS86 SYSTEM BASIS CHIP ASILManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MFS8632BMDA0ES, a System Basis Chip designed for automotive camera applications. This component, part of the FS86 series, offers a robust solution with its 48-VFQFN Exposed Pad package, suitable for surface mount assembly. Operating within a temperature range of -40°C to 125°C (TA) and accepting supply voltages from 4.5V to 36V, it meets stringent automotive qualification standards, including AEC-Q100. The 48-QFN (7x7) supplier device package ensures efficient integration into complex designs. Its primary function as a camera PMIC (Power Management Integrated Circuit) makes it a critical component for advanced driver-assistance systems (ADAS) and in-car infotainment.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 4.5V ~ 36V |
| Applications | Camera |
| Current - Supply | - |
| Supplier Device Package | 48-QFN (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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