MFS8632BMBA0ESR2
SAFETY SYSTEM BASIS CHIP FOR DOMManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. offers the MFS8632BMBA0ESR2, a safety system basis chip designed for automotive camera applications. This electronic component is housed in a 48-HVQFN (7x7) package with an exposed pad and wettable flanks, facilitating surface mount assembly. Qualified to AEC-Q100 standards, it operates reliably within an automotive-grade temperature range of -40°C to 125°C. The device supports supply voltages up to 36V and is supplied in tape and reel packaging. Its specialized design makes it suitable for critical automotive systems requiring enhanced safety functions.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 52 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 36V |
| Applications | Camera |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | Automotive |
| Qualification | AEC-Q100 |
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