MFS2633AMDC3AD
MFS2633AMDC3ADManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2633AMDC3AD is a System Basis Chip designed for advanced power management applications. This component, housed in a 48-LQFP Exposed Pad package with dimensions of 7x7mm, provides a comprehensive power control solution. It operates within a wide supply voltage range of 3.2V to 36V and is qualified for operation across an extended temperature range of -40°C to 125°C. The MFS2633AMDC3AD is suitable for surface mount installation and is supplied in trays. This device finds application in demanding sectors such as automotive, industrial automation, and advanced consumer electronics where robust and integrated power management is critical.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDownload Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 3.2V ~ 36V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-LQFP-EP (7x7) |
| Grade | - |
| Qualification | - |
Request a Quote
Clients Also Buy
MC33PF3000A5ESR2
POWER MANAGEMENT IC I.MX7 PRE-
MC33VR5500V2ESR2
VR5500
MVR5510AMMALESR2
SAFETY POWER MANAGEMENT IC, QFN5
