The NXP USA Inc. MFS2610AMBA0AD is a high-performance automotive System Basis Chip (SBC). This power management integrated circuit (PMIC) is housed in a 48-lead LQFP Exposed Pad package, measuring 7x7mm, designed for surface mounting. It operates across a wide voltage supply range of 3.2V to 40V, with a remarkably low current consumption of just 30µA. Engineered for the demanding automotive environment, it functions reliably within an operating temperature range of -40°C to 125°C. This component is suitable for applications requiring robust power management and system control in automotive applications.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 3.2V ~ 40V |
| Applications | - |
| Current - Supply | 30µA |
| Supplier Device Package | 48-LQFP-EP (7x7) |
| Grade | Automotive |
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