MFS2601AMDA0ADR2
AUTO SBCManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2601AMDA0ADR2 is a power management integrated circuit (PMIC) designed for automotive applications. This component features a 48-LQFP Exposed Pad (7x7) package, suitable for surface mount assembly. Operating within a wide temperature range of -40°C to 125°C (TA), it supports input voltages from 3.2V to 40V and exhibits a low supply current of 30µA. The MFS2601AMDA0ADR2 is packaged on a Tape & Reel (TR) for efficient manufacturing processes. This device is engineered for robust performance in demanding automotive environments.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 3.2V ~ 40V |
| Applications | - |
| Current - Supply | 30µA |
| Supplier Device Package | 48-LQFP-EP (7x7) |
| Grade | Automotive |
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