NXP USA Inc. MFS2601AMBA0AD is a high-performance automotive System Basis Chip (SBC) designed for demanding vehicle applications. This component operates across a wide supply voltage range of 3.2V to 40V and features an exceptionally low current consumption of 30µA in its active state. The MFS2601AMBA0AD is housed in a 48-LQFP Exposed Pad package, measuring 7x7 mm, suitable for surface mount assembly. It operates reliably within an ambient temperature range of -40°C to 125°C, ensuring robust performance in automotive environments. This SBC is engineered to meet stringent automotive quality and reliability standards, making it ideal for control units and complex electronic systems within the automotive sector.
Additional Information
Series: -RoHS Status: ROHS3 CompliantManufacturer Lead Time: 26 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-LQFP Exposed Pad |
| Mounting Type | Surface Mount |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 3.2V ~ 40V |
| Applications | - |
| Current - Supply | 30µA |
| Supplier Device Package | 48-LQFP-EP (7x7) |
| Grade | Automotive |
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