MFS2325BMMA0EPR2
MFS2325BMMA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2325BMMA0EPR2 is a System Basis Chip (SBC) designed for high-performance applications. This component, housed in a 48-HVQFN (7x7) package with exposed pad and wettable flank mounting, offers robust system power management. It supports dual supply voltages of 3.3V and 5V, catering to diverse operational requirements. The MFS2325BMMA0EPR2 is engineered for reliability across an operating temperature range of -40°C to 120°C. This device is suitable for demanding sectors including automotive, industrial automation, and advanced consumer electronics, where integrated power control and system supervision are critical.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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