MFS2325BMBA0EPR2
MFS2325BMBA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2325BMBA0EPR2 is a System Basis Chip (SBC) PMIC housed in a 48-HVQFN (7x7) package. This surface mount component features wettable flanks for enhanced solder joint reliability and operates across a temperature range of -40°C to 120°C. Designed for applications requiring robust power management and system control, it supports 3.3V and 5V supply voltages. The MFS2325BMBA0EPR2 is suitable for demanding environments, finding application in automotive and industrial control systems where precise power delivery and system stability are critical. Its 48-VFQFN exposed pad package facilitates efficient thermal management.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
Request a Quote
Clients Also Buy
MC33PF3000A5ESR2
POWER MANAGEMENT IC I.MX7 PRE-
MC33VR5500V2ESR2
VR5500
MVR5510AMMALESR2
SAFETY POWER MANAGEMENT IC, QFN5
