MFS2325BMBA0EP
MFS2325BMBA0EPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. MFS2325BMBA0EP. This System Basis Chip PMIC is housed in a 48-HVQFN (7x7) package. Designed for surface mount, wettable flank applications, it operates across a temperature range of -40°C to 120°C. The MFS2325BMBA0EP supports dual supply voltages of 3.3V and 5V. Its primary function as a System Basis Chip makes it suitable for integration into various electronic systems. The 48-VFQFN Exposed Pad package facilitates robust thermal management and electrical connection. This component is supplied in Bulk packaging.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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