MFS2324BMMA0EP
MFS2324BMMA0EPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2324BMMA0EP is a System Basis Chip designed for robust power management and system control. This component, housed in a 48-HVQFN (7x7) package with an exposed pad for enhanced thermal performance, features surface mount technology with wettable flanks, facilitating automated assembly and improved solder joint inspection. It operates across a wide temperature range of -40°C to 120°C, making it suitable for demanding environments. The MFS2324BMMA0EP supports dual supply voltages of 3.3V and 5V, offering flexibility in system design. Its applications span automotive, industrial automation, and advanced consumer electronics, where reliable power delivery and integrated control functions are critical.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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