MFS2324BMBA0EPR2
MFS2324BMBA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. MFS2324BMBA0EPR2 is a System Basis Chip designed for demanding applications. This component, housed in a 48-HVQFN (7x7) package with an exposed pad for enhanced thermal management, offers integrated power management functionalities. It supports supply voltages of 3.3V and 5V, making it versatile for various system designs. The MFS2324BMBA0EPR2 is engineered for surface mount installation, featuring wettable flanks for improved solder joint reliability and inspection. Operating across a wide temperature range of -40°C to 120°C, it is suitable for industrial and automotive environments. This component is commonly utilized in advanced automotive systems and complex industrial control platforms.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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