MFS2323BMMA0EPR2
MFS2323BMMA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
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The NXP USA Inc. MFS2323BMMA0EPR2 is a System Basis Chip PMIC housed in a 48-HVQFN (7x7) package. This surface-mount component features wettable flanks for enhanced solder joint reliability. Designed for operation across a wide temperature range of -40°C to 125°C (TA), it supports input supply voltages from 5.5V to 40V. The MFS2323BMMA0EPR2 is supplied in Tape & Reel (TR) packaging. This device is suitable for applications requiring a robust power management integrated circuit within demanding environments.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 5.5V ~ 40V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
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