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MFS2323BMMA0EP

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MFS2323BMMA0EP

MFS2323BMMA0EP

Manufacturer: NXP USA Inc.

Categories: Specialized

Quality Control: Learn More

NXP USA Inc. MFS2323BMMA0EP is a System Basis Chip, a versatile power management integrated circuit designed for demanding applications. This component features a 48-HVQFN (7x7) package with an exposed pad, facilitating robust surface mount integration with wettable flanks. Operating across a supply voltage range of 5.5V to 40V, it is engineered for reliable performance in challenging environments with an extended operating temperature of -40°C to 125°C. The MFS2323BMMA0EP is suitable for integration into automotive systems, industrial automation, and advanced power management solutions where high reliability and precise power control are critical. Its comprehensive feature set makes it an ideal choice for power supply sequencing, voltage regulation, and system monitoring functions.

Additional Information

Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: TrayDatasheet:
Technical Details:
PackagingTray
Package / Case48-VFQFN Exposed Pad
Mounting TypeSurface Mount, Wettable Flank
Operating Temperature-40°C ~ 125°C (TA)
Voltage - Supply5.5V ~ 40V
ApplicationsSystem Basis Chip
Current - Supply-
Supplier Device Package48-HVQFN (7x7)

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