MFS2323BMBA1EPR2
MFS2323BMBA1EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2323BMBA1EPR2 is a power management integrated circuit (PMIC) housed in a 48-HVQFN (7x7) package. This surface-mount device features wettable flanks for enhanced solder joint reliability. Designed for high-performance applications, this component is suitable for demanding industrial and automotive environments, leveraging NXP's expertise in advanced silicon solutions. Its robust construction and packaging ensure consistent operation in critical systems.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Supplier Device Package | 48-HVQFN (7x7) |
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