MFS2323BMBA1EP
MFS2323BMBA1EPManufacturer: NXP USA Inc.
Categories: Specialized
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The NXP USA Inc. MFS2323BMBA1EP is a power management integrated circuit (PMIC) housed in a 48-HVQFN (7x7) package. This surface-mount component features wettable flank terminals, ensuring robust solder joint reliability. Designed for demanding applications, its 48-VFQFN exposed pad package facilitates efficient thermal management. This device is suitable for use in various industries requiring precise power control and high-performance electronic components. It is supplied in tray packaging.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Supplier Device Package | 48-HVQFN (7x7) |
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