MFS2323BMBA0EPR2
MFS2323BMBA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
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NXP USA Inc. MFS2323BMBA0EPR2 is a power management integrated circuit (PMIC) housed in a 48-HVQFN (7x7) package. This surface mount component features wettable flanks for enhanced solder joint reliability, making it suitable for automated assembly processes. Designed for demanding applications, this PMIC is engineered for robust performance and efficient power control. Its compact 48-VFQFN exposed pad package facilitates high-density board designs. The MFS2323BMBA0EPR2 is typically utilized in industrial automation, automotive systems, and advanced consumer electronics where precise power delivery and thermal management are critical. Provided on a Tape & Reel (TR) for high-volume manufacturing.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Supplier Device Package | 48-HVQFN (7x7) |
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