MFS2323BMBA0EP
MFS2323BMBA0EPManufacturer: NXP USA Inc.
Categories: Specialized
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NXP USA Inc. MFS2323BMBA0EP is a power management integrated circuit (PMIC) housed in a 48-HVQFN (7x7) package. This surface mount component features wettable flank terminals for enhanced solder joint inspection and reliability. Designed for high-performance applications, this device is suitable for use in demanding industrial and automotive environments where robust power control is critical. Its exposed pad on the 48-VFQFN package facilitates efficient thermal management. The MFS2323BMBA0EP is supplied in tray packaging, suitable for high-volume manufacturing processes.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: TrayDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tray |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Supplier Device Package | 48-HVQFN (7x7) |
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