MFS2321BMBB2EPR2
MFS2321BMBB2EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MFS2321BMBB2EPR2, a System Basis Chip designed for advanced power management applications. This component, housed in a 48-HVQFN (7x7) package with an exposed pad for enhanced thermal performance, supports a wide input voltage range of 5.5V to 40V. The MFS2321BMBB2EPR2 is suitable for surface mount assembly with wettable flank termination, facilitating robust soldering processes. Operating across a temperature range of -40°C to 125°C (TA), it ensures reliability in demanding environments. This device is commonly integrated into automotive, industrial, and consumer electronics systems requiring sophisticated power control and monitoring functions. The component is supplied in Tape & Reel packaging.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 5.5V ~ 40V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
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