MFS2320BMBB1EPR2
MFS2320BMBB1EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
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NXP USA Inc. MFS2320BMBB1EPR2 is a System Basis Chip designed for high-voltage applications requiring robust power management. This component, housed in a 48-HVQFN (7x7) package, operates across a wide supply voltage range of 5.5V to 40V. Its efficient design features a low supply current of 30µA, making it suitable for power-sensitive systems. The MFS2320BMBB1EPR2 is engineered for surface mount installation with wettable flank technology, facilitating automated assembly and ensuring reliable solder joints. Operating temperatures range from -40°C to 125°C, providing stability in demanding environments. This device is commonly utilized in automotive and industrial control systems where integrated power management and system control are critical. The component is supplied in Tape & Reel packaging.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: Tape & Reel (TR)Datasheet:Download Free CAD Model:
Technical Details:
| Packaging | Tape & Reel (TR) |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 125°C (TA) |
| Voltage - Supply | 5.5V ~ 40V |
| Applications | System Basis Chip |
| Current - Supply | 30µA |
| Supplier Device Package | 48-HVQFN (7x7) |
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