MFS2305BMMA0EPR2
MFS2305BMMA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. presents the MFS2305BMMA0EPR2, a System Basis Chip designed for demanding applications. This component, housed in a 48-HVQFN (7x7) package with wettable flanks for enhanced surface mount assembly, operates across a wide temperature range of -40°C to 120°C. It supports dual supply voltages of 3.3V and 5V, making it versatile for various system architectures. The MFS2305BMMA0EPR2 is suitable for implementation in automotive and industrial control systems where robust power management and system integration are critical. Its exposed pad in the 48-VFQFN configuration facilitates efficient thermal dissipation.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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