MFS2305BMMA0EP
MFS2305BMMA0EPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2305BMMA0EP is a System Basis Chip designed for demanding applications. This component features a 48-HVQFN (7x7) package with an exposed pad, facilitating efficient thermal management. It supports dual operating voltages of 3.3V and 5V and is designed for surface mount installation with wettable flanks, ensuring robust soldering performance. The MFS2305BMMA0EP operates across a wide temperature range of -40°C to 120°C. This device is particularly well-suited for use in automotive and industrial control systems where reliable power management and system integration are critical.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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