MFS2305BMBA0EPR2
MFS2305BMBA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2305BMBA0EPR2 is a System Basis Chip designed for advanced power management and system control applications. This component, housed in a 48-HVQFN (7x7) package with wettable flanks for enhanced solder joint reliability, supports dual supply voltages of 3.3V and 5V. Its operating temperature range of -40°C to 120°C makes it suitable for demanding environments. The MFS2305BMBA0EPR2 is engineered for high-performance systems, finding utility across automotive, industrial automation, and high-reliability consumer electronics sectors. Its robust packaging and operational specifications ensure dependable performance in critical designs.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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