MFS2305BMBA0EP
MFS2305BMBA0EPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc. MFS2305BMBA0EP is a System Basis Chip designed for high-performance applications. This component is housed in a 48-HVQFN (7x7) package with an exposed pad, facilitating efficient thermal management and robust surface mount connectivity with wettable flanks. Operating across a temperature range of -40°C to 120°C, it supports supply voltages of 3.3V and 5V. The MFS2305BMBA0EP is utilized in demanding sectors such as automotive, industrial automation, and advanced consumer electronics, where reliable power management and system control are critical. Its design integrates multiple functions essential for system initialization and ongoing operation, making it a key element in complex electronic architectures.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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