MFS2304BMMA0EPR2
MFS2304BMMA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2304BMMA0EPR2 is a System Basis Chip designed for advanced power management applications. This component, housed in a 48-HVQFN (7x7) package, features wettable flank surface mount technology for robust soldering and inspection. It supports dual voltage supplies at 3.3V and 5V, enabling flexible system design. The MFS2304BMMA0EPR2 operates across a wide temperature range from -40°C to 120°C, making it suitable for demanding environments. Its architecture as a System Basis Chip integrates essential power and control functions, common in automotive, industrial automation, and high-performance computing systems. The 48-VFQFN Exposed Pad package design ensures efficient thermal dissipation.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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