MFS2304BMMA0EP
MFS2304BMMA0EPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2304BMMA0EP is a System Basis Chip designed for advanced power management applications. This component, housed in a 48-HVQFN (7x7) package with wettable flanks, offers robust functionality for demanding environments. Featuring surface mount compatibility and an exposed pad for enhanced thermal performance, it operates reliably across a wide temperature range of -40°C to 120°C. The MFS2304BMMA0EP supports dual supply voltages of 3.3V and 5V, making it suitable for integration into complex electronic systems. Its versatility lends itself to applications within the automotive, industrial, and consumer electronics sectors, where precise power control and system stability are paramount. The 48-VFQFN Exposed Pad package facilitates efficient board layout and assembly.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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