MFS2304BMBA0EPR2
MFS2304BMBA0EPR2Manufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
NXP USA Inc.'s MFS2304BMBA0EPR2 is a System Basis Chip designed for demanding applications. This component, housed in a 48-HVQFN (7x7) package with wettable flank surface mount capability, operates across a wide temperature range of -40°C to 120°C. It supports dual supply voltages of 3.3V and 5V, making it versatile for various system architectures. The MFS2304BMBA0EPR2 is particularly suited for automotive and industrial control systems, where robust power management and system integration are critical. Its exposed pad design in the 48-VFQFN package ensures efficient thermal performance. This component is supplied in bulk packaging.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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