MFS2304BMBA0EP
MFS2304BMBA0EPManufacturer: NXP USA Inc.
Categories: Specialized
Quality Control: Learn More
The NXP USA Inc. MFS2304BMBA0EP is a System Basis Chip (SBC) designed for advanced power management and system control applications. This component, housed in a 48-HVQFN (7x7) package, features wettable flank surface mount technology for enhanced solder joint reliability. It supports dual supply voltages of 3.3V and 5V, integrating multiple power rails and control functions essential for complex electronic systems. The MFS2304BMBA0EP operates within a temperature range of -40°C to 120°C, making it suitable for demanding environments. This device finds application across automotive, industrial automation, and advanced consumer electronics where robust power management and system integration are critical. The 48-VFQFN Exposed Pad package facilitates efficient thermal dissipation.
Additional Information
Series: -RoHS Status: RoHS CompliantManufacturer Lead Time: 30 week(s)Product Status: ActivePackaging: BulkDatasheet:Download Free CAD Model:
Technical Details:
| Packaging | Bulk |
| Package / Case | 48-VFQFN Exposed Pad |
| Mounting Type | Surface Mount, Wettable Flank |
| Operating Temperature | -40°C ~ 120°C |
| Voltage - Supply | 3.3V, 5V |
| Applications | System Basis Chip |
| Current - Supply | - |
| Supplier Device Package | 48-HVQFN (7x7) |
| Grade | - |
| Qualification | - |
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